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Chip Component Carrier Tape Packaging Machine After High-Temperature Testing

Chip Component Carrier Tape Packaging Machine After High-Temperature Testing
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3D model of carrier tape packaging machine for SMD components after high-temperature testing designed with SolidWorks 2014, Sldprt and Sldasm source files + STEP universal files provided. Directly load SMD components into carrier tapes after testing and onto the SMT machine. This machine can simultaneously test multiple components. The device is abbreviated as: high-temperature test packaging machine. After decompression, it's over 120M, and the structure is relatively complete. It is a good model for learning and research. Welcome everyone to download.

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Published:

Jan 06, 2026 10:57 AM

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v1

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