3D model of automatic labeling machine for semiconductor wafers. The equipment mainly consists of an automatic loading and unloading mechanism, paper feeding mechanism, paper cutting mechanism, label sticking mechanism, and waste paper recycling mechanism. It can automatically adjust for different products in the 6-inch and 8-inch wafer series. The equipment is now in mass production and has a good market effect. It can also serve as a case for communication and learning among many non-standard automation enthusiasts. Welcome to download the automatic semiconductor wafer labeling machine.
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